CANopen Chip CoC-100

SYS-4003001 , SYS-4003002

Next Generation - the New CANopen Chip 

Like its predecessor, the sysWORXX CANopen Chip F40, the new sysWORXX CANopen Chip CoC-100 is a fully operational plug-in module with pre-programmed CANopen firmware. The integrated standard DIP-40 connector forms the interface to the target hardware and makes the sysWORXX CANopen Chip CoC-100 a versatile communications interface.

With up to 7 I/O configurations, it provides a comprehensive selection of usable digital inputs and outputs, analog inputs and PWM outputs. The on-board configuration options allow a flexible module configuration. The sysWORXX CANopen Chip CoC-100 is a CANopen Slave Device according to the CANopen device profile CiA DSP 401 V3.1.0 and CANopen communication profile CiA 301 V4.2.0 (tested with the CiA Conformance Test Tool). LEDs show the device status according to CiA 303-3 V1.4.


  • Single board CANopen I/O-node in 40-pin DIP dimensions (24x56mm) populated with NXP S32K142 32-bit microcontroller
  • Controller signals and ports extending to standard-width (2.54 mm.) pin rows lining the edges of the board
  • CAN signals (CANH, CANL) in CAN 2.0B passive mode
  • Reference voltage pins for the on-chip A/D-converter
  • Non-volatile storage of CANopen configuration parameters
  • 5.0V on-board MCP2562 CAN transceiver (4003001)
  • 3.3V on-board TCAN337GDR CAN transceiver (4003002)
  • CAN signals also available for connection to an external, optically isolated CAN transceiver
  • 8-position DIP-switch enables selection of: Node-ID (4-bit), baud rate (2-bit) and I/O configuration (2-bit),


    Controller: NXP S32K142 32-bit  microcontroller
    Operating voltage:

    4.5V - 5.5V (SYS-4003001)

    3.0V - 3.6V (SYS-4003002)

    Current consumption: typically 25mA, max. 185mA (SYS-4003002) resp. 195mA (SYS-4003001) depends on circuitry of I/Os and CAN
    Storage: Non-volatile memory for storage of configuration data
    Configuration: DIP-switches for easy configuration of node ID, baud rate and IO configuration
    Available I/O configuration: Seven different IO configurations on 28 IO pins, selectable via DIP-switch and Object Dictionary
    Digital outputs: GND < L-level < 0.4V
    4.5V < H-level < VCC
    Digital inputs: GND - 0.3V < L-level < 0.8V
    0.8 VCC < H-level < VCC + 0.3V
    Analog inputs: Input voltage: VAGND … VREF
    Resolution: 12-bit (see manual)
    Input capacity: 19 pF (typ.)
    Reference voltage: +2.7V ... VCC
    PWM outputs: See digital outputs for details
    PWM frequency: max. 21kHz (CAN>10kBit)
    PWM frequency: max. 11,5kHz (CAN=10kBit)
    CAN transceiver: on-board TI TCAN337GDR (SYS-4003002 3.3V version), MCP2562 (SYS-4003001 5V version)
    CAN bus bitrate: 10kBit/s to 1Mbit/s
    Operating temperature: -40°C to +85°C
    Storage temperature: -40°C to +90°C
    Dimensions (LxWxH): 58,7mm x 24,0 mm x 11,8 ±0,3 mm
    Weight: ca. 10,5g
    Socket connector: 40-pin Dual-Inline-IC-socket, grid dimension 2,54 x 15,24
    Pin-header: grid dimension 2,54 mm, Ø0,47mm, pin length 3,2 mm
    x